Design and Optimization of the Geometrical parameters for an efficient monolithically interconnected Dye Sensitized Solar Cell Mini-Module (10cm × 10cm)
P.R. Bobbili a, H.M. Upadhyaya a, Obinna Onuoha a, A. Ivaturi a, S. Senthilarasu b
a Energy Conversion Lab (ECL), Institute of Mechanical Process and Energy Engineering (IMPEE) School of Engineering and Physical Sciences, Heriot-Watt University,Riccartion Edinburgh
b Environmental and Sustainability Institute, University of Exeter Penryn Campus, Penryn, TR10 9FE
Poster, Obinna Onuoha, 107
Publication date: 1st July 2014
Dye sensitized Solar Cell (DSC) technology has attracted lots of interest over the last few years, this is owing to the cost reduction potential, which is based on the use of inexpensive components, its relative simple production method and its wide applicability. However, monolithically series interconnected DSC modules further reduce the cost and enhance stability of the design by providing better sealing and encapsulation for durability of the cell and reduction in the module dead-area. The novelty of the method is that it makes the interconnection possible in liquid as well as solid state DSC configurations using the same strategy. In this study, fabrication of monolithically inter-connected Dye sensitized Solar Cell (DSC) modules was successfully carried out for mini-modules of 5cm × 5cm and 10cm × 10cm and the optimal component geometric factors i.e. cell thickness, cell width, spacer thickness and inter-cell distance(dead-area) have been investigated using versatile Impedance Spectroscopy and I-V characteristics under AM1.5 G one sun illumination. A series interconnection of strips of 10 individual cells resulting in a module of 10cm × 10cm with an active area of almost 90% have been demonstrated with an efficiency of about 3.5% without using catalytic interlayer. In the present study efficiency of 6% has been achieved for DSC of 4cm2 area (0.8cm × 4cm) using catalytic interlayer between the spacer and the working electrode layers. The optimisation of the geometrical parameters related with the interconnection strategy has resulted in an appreciably high fill factor almost close to 70%. The impedance spectroscopy studies have been utilised to understand the inter-cell interaction and optimisation of the electrical parameters with optimal module structure. Novel module manufacturing method that is cheap, guaranties high efficiency and a drastic reduction in module overall series resistance has been discussed.

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