Publication date: 10th April 2024
Atmospheric Pressure Spatial Atomic Layer Deposition (AP-SALD) is a recent variant of ALD that offers fast processing while preserving the unique assets of ALD, namely, precise thickness control down to the nanometer, high-quality films even at low temperatures, and unique conformality. As a result, AP-SALD is ideal for applications requiring high throughput at low cost, such as new generation energy devices. In particular, the AP-SALD approach based on close-proximity deposition heads is highly versatile since it can be easily customized by proper design of the deposition heads and because the deposition takes place in the open air without the need of any deposition chamber.
But there is more to AP-SALD than a faster and scalable version of ALD. In particular, In my talk I will illustrate how 3D printing can be used to prototype and customize close-proximity deposition heads, and how in so doing SALD can indeed be tuned to deposit custom patterns without the need of pre-patterning steps, or be adapted to tubular substrates such as separation membranes. I will then present our studies showing the effect of open-air processing on the properties of the thin films deposited with our close-proximity system, and how the choice of precursor can have a huge impact on the final properties of the materials deposited. I will finally present recent results on the deposition of functional thin films for electrochemical energy devices.
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