Publication date: 10th April 2024
Materials engineering through thin-film nanostructuring represents an ideal playground for the investigation of model systems with novel or improved functionalities. In the context of high-temperature cathode materials, improved kinetics has been achieved, notably through strategies such as grain boundary engineering and heterostructuring.1,2,3 Despite these advancements, however, an open question pertains to the practical relevance of such structures in real electrochemical devices. Existing constrains such as processability and long-term thermochemical stability have considerably hindered, to date, the application of advanced thin-film technology to high-temperature energy devices like solid oxide cells. This contribution addresses these challenges by presenting practical examples that demonstrate how the strategic introduction of defects can be leveraged in order to optimize the performance-stability trade-off in electrochemically active films for oxygen reduction reaction. For 0-dimensional defects, we will introduce results on a combinatorial study for the (La,Sr)(Mn,Fe,Co)O3 system. Employing a suite of automated and semi-automated characterization tools, we were able to map the electrochemical behavior of the ternary compositional space, demonstrating that aliovalent cationic substitution is an effective tool for balancing high electrochemical activity and enhanced thermal stability. Another example showcases our latest findings on perovskite/fluorite self-assembled nanostructures.4 Here depending on the materials of choice, distinct long-range orders are obtained. Despite the architecture variations, a general increase in the oxygen-reduction kinetics (over one order of magnitude) is achieved with respect to single-phase reference materials. Furthermore, the long-term stability of the material operating under real conditions is demonstrated. Finally, the successful implementation of such thin-film systems as high-performance cathodes in full solid-oxide cells is shown, highlighting the potential of thin-film engineering for practical implementation.