Proceedings of nanoGe Fall Meeting 2021 (NFM21)
DOI: https://doi.org/10.29363/nanoge.nfm.2021.259
Publication date: 23rd September 2021
Ligand-functionalised gold nanoparticles, AuNPs, are promising conductive ink materials for printed electronics since they provide good dispersion in organic solvents, long shelf-life at ambient conditions, good printability and electrical conductivity after sintering. However, their mechanical and electrical performance degradation under external mechanical deformation often occurs due to the failure of the stress redistribution at microcracks and pores formed within printed structures, which limits their application for flexible electronics. Here, we employ a thiol-terminated additive as a cohesion enhancer in a gold conductive ink formulation to prevent the formation of microcracks and pores arising from the increased surface energy of nanoparticles during drying and sintering processes. The gold ink formulation with the cohesion enhancer exhibits high electrical conductivity of 5.3´106 S/m and electrical performance stability under mechanical deformation for a single printed layer due to the enhanced cohesion compared to the formulation without the cohesion enhancer, which offers exciting potential for their application in flexible electronics.
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