Electron and Hole Transport Layers for Sb2Se3 Solar Cells
Jon Major a
a University of Liverpool, UK, University of Liverpool, Liverpool, United Kingdom
Materials for Sustainable Development Conference (MATSUS)
Proceedings of MATSUS Spring 2025 Conference (MATSUSSpring25)
Emerging chalcogenide materials for thin film photovoltaic applications - #ChalcoPV
Sevilla, Spain, 2025 March 3rd - 7th
Organizers: Giulia Longo and Lucy Whalley
Invited Speaker, Jon Major, presentation 322
DOI: https://doi.org/10.29363/nanoge.matsusspring.2025.322
Publication date: 16th December 2024

The evolution of Sb2Se3 heterojunction devices away from CdS electron transport layers (ETL) to wide band gap metal oxide alternatives is a critical target in the development of this emerging photovoltaic material. Metal oxide ETL/Sb2Se3 device performance has historically been limited by relatively low fill-factors (FF), despite offering clear advantages with regards to photocurrent collection. In this work, TiO2 ETLs were fabricated via direct current (DC) reactive sputtering and tested in complete Sb2Se3 devices. A strong correlation between TiO2 ETL processing conditions and the Sb2Se3 solar cell device response under forward bias conditions was observed and optimised. Ultimately, a SnO2:F/TiO2/Sb2Se3/P3HT/Au device with the reactively sputtered TiO2 ETL delivers an 8.12% power conversion efficiency (η), the highest cadmium-free Sb2Se3 device reported to-date. This is achieved by a substantial reduction in series resistance (Rs), driven by improved crystallinity of the reactively sputtered anatase-TiO2 ETL, whilst maintaining almost maximum current collection for this device architecture. This paper will also discuss the role of organic hole transport materials ‐ namely P3HT, PCDTBT, and spiro‐OMeTAD to modify device performance. By comparing these against one another, and to a reference device, their role in the device stack are clarified. These organic HTM layers are found to serve a dual purpose, increasing both the average and peak efficiency by simultaneously blocking pinholes and improving the band alignment at the back contact.

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