Napththalene Diimmide Cation Assisted Charge Transport in Lead Free Dion-Jacobson Type Hybrid Perovskite
Waygen Thor a, Jun-Ho Yum a, Kevin Sivula a
a Laboratory for Molecular Engineering of Optoelectronic Nanomaterials, Institut des Sciences et Ingénierie Chimiques, Ecole Polytechnique Fédérale de Lausanne (EPFL), 1015 Lausanne, Switzerland
Materials for Sustainable Development Conference (MATSUS)
Proceedings of MATSUS Fall 2024 Conference (MATSUSFall24)
#PeroMAT- Halide perovskite and perovskite- inspired materials: synthesis and applications
Lausanne, Switzerland, 2024 November 12th - 15th
Organizers: Raquel Galian, Lakshminarayana Polavarapu and Paola Vivo
Oral, Waygen Thor, presentation 151
DOI: https://doi.org/10.29363/nanoge.matsusfall.2024.151
Publication date: 28th August 2024

Tuning the crystallinity, stability, and optoelectronic properties of tin halide perovskite-based semiconductors is crucial for advancing these promising materials toward practical device applications. Embedding organic semiconductor cations within the layered structure of tin perovskites can offer an effective means to attenuate the dielectric and quantum confinement effects by enabling the charge transfer between the organic and inorganic layers. However, incorporating bulky pi-conjugated organic semiconductor cations in layered perovskites is a challenge. Herein we leverage our previously demonstrated molecular engineering strategy[1] to afford the incorporation of napththalene diimmide (NDI) cations with alkyl chain lengths of 6 carbons into two-dimensional (2D) tin halide perovskites that show enhanced electron mobility and air stability. We show the importance of both cation molecular structure and processing conditions in obtaining high quality thin films. Additionally, we discuss the role of additives in facilitating the formation of quasi-2D tin halide perovskites with enhanced crystallinity and elucidate the importance of the additive molecular structure—suggesting this strategy can generally advance the structural qualities of solution-processed perovskite materials, and consequently enhance device performance and stability.

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