Development of a tin perovskite deposition method independent of the substrate size and wettability by using imidazole derivatives
Fuyuki Harata a, Tomoya Nakamura a, Minh Anh Truong a, Richard Murdey a, Atsushi Wakamiya a
a Institute for Chemical Research, Kyoto University
Poster, Fuyuki Harata, 077
Publication date: 17th October 2024

Recently, tin halide perovskite has been attracting attention as an environmentally friendly alternative to lead perovskite solar cells. However, the rapid crystallization of Sn perovskite makes it difficult to control the film morphology. Although the most common way to obtain a tin perovskite thin film is dripping the antisolvent during the spin coating, the film morphology deteriorates when the substrate size increases or when applied to hydrophobic substrates. Therefore, the antisolvent-free fabrication method that can control the Sn perovskite film morphology, regardless of the underlying layer, is highly desired.

In this work, we developed a vacuum quenching fabrication method for Sn perovskite films by using imidazole derivatives as a crystal growth regulator. Perovskite thin films were fabricated by drying the wet film of perovskite precursor under vacuum and then annealing the substrates to remove the additives [1]. When the imidazole derivative was added to the perovskite precursor solution, the surface coverage of tin halide perovskite film improved to 100% from 45% without additives. Imidazole derivatives coordinate to Sn2+ ion in the solution and effectively retard the crystal growth of tin halide perovskite. This method enabled the fabrication of uniform tin halide perovskite thin films on a large area (7.5×7.5 cm2) substrate. Tin halide perovskite solar modules (ITO/PEDOT:PSS/EDA0.01FA0.98SnI3/C60/BCP/Ag) with an active area of 21.6 cm2 were fabricated, showing power conversion efficiencies of up to 6.8%. In addition, we also successfully fabricated pinhole-free films on hydrophobic hole-collecting monolayer surfaces, with the resulting tin perovskite solar cell devices with hole-transporting monolayers reaching a maximum PCE of 10.7%.

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