Stability of Metal Contacts in Perovskite Solar Cells
Jilian Nei de Freitas a, Andreia de Morais a, José Maria Clemente Silva Filho b, Francisco das Chagas Marques b
a Centro de Tecnologia da Informação Renato Archer - CTI - Campinas-SP, Brazil
b Institute of Chemistry, , University of Campinas, Campinas, 13083-861, SP, Brazil
Asia-Pacific International Conference on Perovskite, Organic Photovoltaics and Optoelectronics
Proceedings of Asia-Pacific International Conference on Perovskite, Organic Photovoltaics and Optoelectronics (IPEROP24)
Tokyo, Japan, 2024 January 21st - 23rd
Organizers: Qing Shen and James Ryan
Oral, Jilian Nei de Freitas, presentation 040
DOI: https://doi.org/10.29363/nanoge.iperop.2024.040
Publication date: 18th October 2023

Charge collection in large-area perovskite solar cells is achieved by using a metallic contact in at least one side of the cell (top or bottom contact), and Ag is often the metal of choice for that purpose [1]. However, this material suffers progressive degradation due to reaction with iodide species from the perovskite layer [2]. It is also detrimental for the device if metal atoms diffuse to the inner layers of the cell. Thus, the metal contact is a component that might also induce instability points in perovskite solar cells. Therefore, the search for a metal that could show adequate cost, electrical conductivity and chemical stability (i.e., less prone to unwanted interactions with other cell components) is imperative for the industrialization this technology. Herein, we investigated a series of different metals typically used in photovoltaic or electronic industries, as bottom contacts in large-are perovskite single cells. Metal grids based on Ag, Al, Au, Cu, Mo, Ni, Pd, Pt or Ta were deposited by sputtering onto 5 x 5 cm2 FTO-glass substrates, and their electrical and morphological characteristics were evaluated in different conditions. Overall, as-deposited grids exhibited good adherence to the substrate, and the grid lines were continuous, without pinholes, as observed by scanning electron microscopy (SEM) and optical microscopy (OM). Then, the grids were subjected to the different steps of a typical n-i-p perovskite cell assembly procedure: a) cleaning step; b) UV-ozone treatment; c) heating at 180 °C for 1 hour (mimicking the treatments applied for the SnO2 ETL deposition); and d) heating at 100 °C for 1h (mimicking the perovskite annealing step). SEM, OM and resistivity data (obtained from 4 point probe measurements) were collected after each step, and after performing a sequence comprising of all 4 steps, which would be used in a complete cell assembly. Afterwards, the stability of the metals when in contact with the SnO2 layer or in direct contact with the perovskite layer was evaluated, by carrying out two types of aging tests. Those experiments were designed to observe what would happen in an operating cell, if the metal component and the perovskite layer come in contact due to the presence of defects in the selective contacts, or by diffusion of the components through the layers. The data gathered reveal that most of the metals suffer some sort of degradation in at least one of the conditions investigated in this work, showing that a careful selection of the metal contact is of utmost importance for long-term stability of these cells.

PCI/CNPq (301138/2021-4), FAPESP (2017/11986-5) and Shell Brasil.

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