Publication date: 8th January 2019
Organic materials continue to make an impact on a wide variety of optoelectronic applications due to an ever-increasing chemical design space, novel tools to assemble these interesting materials, and the advancement of novel device architectures and devices. One important aspect thereby is how to achieve assembly not only on the molecular- and on the meso-scale, but also on the hundreds of nanometer to micrometer scale. Various devices and applications, indeed, require the active material to be patterned and/or to be deposited at pre-determined locations. In areas, such as the bioelectronics field, step-changes may be achieved when more complex, multidimensional architectures that mimic the hierarchical structures of, e.g., tissues or bones could be man-made using stimuli-responsive functional organic materials. Other potential lies in nano- and micro-engineering multifaceted structures to realize new media with unique interactions with electromagnetic radiation. This would lead to new possibilities to harvest light and manipulate light-matter interactions. Here we use model systems to demonstrate hierarchical assembly of organic nanoparticles, covering a range of systems, from inert polystyrene particles to conjugated polymer emitter particles made, e.g., of polyfluorene-co-divinylbenzene (F8DVB)[1]. We show that surface relief structures can be used to direct this process. Thereby, simple geometrical relationships can be employed to program the particles to deposit into specific sites and patterns: from ordered to disordered arrangements; hexagonally-packed, square-packed or random-packed structures; to single layer vs. multilayer architectures. This opens a versatile design platform in terms of the fabrication of multifunctional nano- and microstructures with hierarchies for use in the field of photonics (e.g., in solar cells, light-emitting diodes and optical display devices over large areas), bioelectronics and beyond.
We acknowledge support from the EPSRC: EP/K03099X/1–Centre for Innovative Manufacturing in Large Area Electronics, for financial support. SC moreover is highly grateful for a fellowship sponsored by the China Scholarship Council.
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