Proceedings of International Conference on Hybrid and Organic Photovoltaics (HOPV19)
DOI: https://doi.org/10.29363/nanoge.hopv.2020.121
Publication date: 6th February 2020
There is a clear need for a new transparent electrode compatible with flexible organic photovoltaics (OPVs) and made from low-cost raw materials. This talk will present a high-performance copper (Cu) electrode based on a Cu grid fabricated by soft lithography and demonstrate its utility in PV devices with ~10% efficiency. Even before the addition of an anti-reflecting charge transport layer the electrode has an average far field transparency of ≥ 85% which is achieved for a sheet resistance < 10 Ω sq-1. The novelty of the fabrication process is twofold: (i) an extremely rapid and clean metal etch process using a low toxicity etchant (ii) an ultrathin mask which can remain in place after etching without consequence, which together speed up and simplify electrode fabrication and integration into OPV devices. At ~1% the material cost of comparable Ag-mesh electrodes, we show these electrodes can compete with indium tin oxide (ITO) as the transparent electrode in high-performance OPVs with further advantages through their inherent flexibility.