Proceedings of International Conference Asia-Pacific Hybrid and Organic Photovoltaics 2018 (AP-HOPV18)
Publication date: 27th October 2017
Electrospray (ES) method can be used for the deposition of organic thin films. This method would be useful for the fabrication of low cost organic thin film solar cells. Furthermore, it can also be used for the deposition of thin films on a flexible substrate. In this study, the structure of our device is consist of ITO glass/PEDOT:PSS (30 nm)/ Active layer (100 nm)/Al. The active layer of the organic thin film solar cells is deposited by ES method. Also, the deposition conditions were optimized by varying the flow rate. The morphology of the active layer was studied using the optical microscope, while the photovoltaic performance of the device was evaluated by measuring the current density-voltage (J-V).
The sprayed solution is a mixture of 10 mg of poly-hexylthiophene-2,5-diyl (P3HT), 7 mg of phenyl-C61-butyric-acid methyl ester (PC60BM), 10 ml of 1,2-dichlorobenzene, and 10 vol% of acetonitrile. It is reported that acetonitrile solvent which has high relative dielectric constant can improve the spray ability. Therefore, the acetonitrile was added into the solvent. To achieve the best spray conditions, the flow rate and applied voltage were adjusted from 0.125 to 0.375ml/h, 7 to 12kV, respectively.
According to the surface morphology formed at different flow rates, the droplets shape became larger with increasing flow rate. It was observed that the device efficiency of the solar cell fabricated by ES method was almost similar to the performance of the device using spin coat method in our laboratory. For the spin coat method, we achieved a power conversion efficiency (PCE) of 1.17%, whereas the ES method achieved a PCE 1.05%. On the other hand, the active layer deposited by the ES method has large irregularities on the surface. Such a surface can cause an increase in series resistance (Rs) and leakage current. The Rs value of the device fabricated by ES method was approximate 1.3 times higher than the device fabricated by spin coat method. Therefore, it is necessary to enhance the surface roughness of the active layer.
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