DOI: https://doi.org/10.29363/nanoge.aohm.2019.017
Publication date: 8th January 2019
In this presentation we report the development of novel semiconductors, as well as the process engineering, for flexible circuits. In particular we show that “ultra-soft” polymers comprising NDI units co-polymerized with “rigid” and “flexible” organic units can change how charge transport is affected by mechanical stress, demonstrating that polymer backbone composition is more important that film degree of texturing. Furthermore, by fabricating polymer/polymer blends by shear techniques, it provides a new avenue to enhance charge transport and achieve excellent mechanical robustness, which is further increase by modification of the film morphology. Furthermore, we report new “soft” polymer-metal oxide alloys, where the insulating polymer can promote formation of semiconducting metal oxide amorphous phases but with improved charge carrier mobility. By selecting polymers containing a different degree of amine nitrogen content, the charge transport of these blends can be manipulated to a greater extent. Again, these materials, and the corresponding electronic building blocks, can sustain far larger stresses than those based on pure metal oxide matrices. We demonstrate that these materials can enable TFT-based circuits for ultra-flexible displays and sensors on plastics. Finally, new oxide-polymer blends can be used to fabricate high-rectification and stretchable diodes via the self-assembly/phase separation properties of polymers having different surface energy.
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