DOI: https://doi.org/10.29363/nanoge.aohm.2019.011
Publication date: 8th January 2019
Organic semiconductors are highly attractive for large-area, low-cost, lightweight, flexible and bendable electronic applications, but their transition to market place is delayed by inadequate performance. Inefficient charge injection represents a significant hurdle in the pursuit of the promised potential of organic semiconductors. This issue becomes even more severe with increasing the effective mobility of the organic layer and reducing the channel dimensions. In this talk, I will discuss the origin and characterization of contact effects in organic field-effect transistors (OFETs) and their impact on device performance and accuracy in extraction of charge carrier mobility. I will present a strategy for reducing contact resistance in small molecule and polymeric OFETs consisting of developing high work function surface domains at the surface of the injecting electrodes to promote channels of enhanced injection.[1] This led to contact resistances of 200 Ωcm and device charge carrier mobilities of 20 cm2/Vs independent of the applied gate voltage. In addition to allowing the demonstration of high-mobility transistors with near ideal current-voltage characteristics, the use of this method has lead to accurate measurement of the charge carrier mobility, a critical step in a rational material design.
In the second part of my talk, I will present a method for contact deposition and patterning that allows fabrication of all-printed OFETs on conventional paper. The method relies on depositing contacts using aerosol spray and patterning them with a digitally printed mask from an office laser printer, at ambient temperature and pressure. This technique, which we have denoted aerosol spray laser lithography, is cost-effective and extremely versatile in terms of material choice and electrode geometry. The method was successfully adopted for manufacturing different types of electrode materials, that showed an excellent tolerance to extreme bending, confirming its potential for emerging printed electronics applications.
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